Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6077728 | Method of producing a ceramic package main body | Kozo Yamasaki | 2000-06-20 |
| 5822851 | Method of producing a ceramic package main body | Kozo Yamasaki | 1998-10-20 |
| 5621190 | Ceramic package main body | Kozo Yamasaki | 1997-04-15 |
| 5545598 | High heat conductive body and wiring base substrate fitted with the same | Kouki Ogawa, Kozo Yamasaki | 1996-08-13 |
| 5293069 | Ceramic-glass IC package assembly having multiple conductive layers | Kazuyuki Maruyama | 1994-03-08 |
| 5060049 | Multiple resistivity wiring apparatus | Kozo Yamasaki, Kouichi Mouri, Mitsuru Hirano, Michael A. Schmitt, Bidyut K. Bhattacharyya | 1991-10-22 |