Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6976415 | Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panel | Shinji Yuri, Kazuhisa Sato, Kozo Yamasaki | 2005-12-20 |
| 6872436 | Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panel | Shinji Yuri, Kazuhisa Sato, Kozo Yamasaki | 2005-03-29 |
| 6803658 | Substrate with top-flattened solder bumps and method for manufacturing the same | — | 2004-10-12 |
| 6719185 | Substrate with top-flattened solder bumps and method for manufacturing the same | — | 2004-04-13 |