Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11410895 | Wiring board | Yosuke Imoto, Shinichiro Haneishi, Kenji Suzuki, Norihiko Kawai | 2022-08-09 |
| 10985087 | Wiring board | Yosuke Imoto, Shinichiro Haneishi, Kenji Suzuki, Norihiko Kawai | 2021-04-20 |
| 9412676 | Ceramic package | Hiroaki Yamamoto, Yoshitaka Yoshida, Takatoshi Tojo, Kazushige Akita, Jun Suzuki | 2016-08-09 |
| 9295151 | Wiring substrate, multi-piece wiring substrate, and method for manufacturing same | Masami Hasegawa, Satoshi Hirayama | 2016-03-22 |
| 9232643 | Ceramic wiring board, multi-piece ceramic wiring board, and method for producing same | Masami Hasegawa, Satoshi Hirayama | 2016-01-05 |
| 9215802 | Wiring substrate and multi-piece wiring substrate | Jyun Suzuki, Masami Hasegawa, Chizuo Nakashima | 2015-12-15 |
| 8987604 | Wiring substrate, multi-piece wiring substrate, and method for producing same | Masami Hasegawa, Satoshi Hirayama | 2015-03-24 |
| 8952269 | Wiring substrate, multi-piece wiring substrate array, and manufacturing method therefor | Masami Hasegawa, Satoshi Hirayama | 2015-02-10 |
| 6674017 | Multilayer-wiring substrate and method for fabricating same | Kozo Yamasaki, Osamu Hisada, Katsuhiko Hasegawa, Satoshi Hirano | 2004-01-06 |
| 6139904 | Method of making a printed board | Kozo Yamasaki, Osamu Hisada, Katsuhiko Hasegawa, Satoshi Hirano, Yutaro Kameyama | 2000-10-31 |