Issued Patents All Time
Showing 51–59 of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6603154 | Semiconductor package and method of manufacturing semiconductor package | Yoshinori Sakai, Kazuo Arisue | 2003-08-05 |
| 5917156 | Circuit board having electrodes and pre-deposit solder receiver | Kazuto Nishida, Norihito Tsukahara | 1999-06-29 |
| 5616024 | Apparatuses for heating semiconductor wafers, ceramic heaters and a process for manufacturing the same, a process for manufacturing ceramic articles | Ryusuke Ushikoshi, Koichi Umemoto, Atsushi Sakon, Yusuke Niiori, Masahiro Murasato | 1997-04-01 |
| 5573690 | Ceramic articles | Koichi Umemoto, Ryusuke Ushikoshi, Shinji Yamaguchi | 1996-11-12 |
| 5490228 | Heating units for use in semiconductor-producing apparatuses and production thereof | Takao Soma, Ryusuke Ushikoshi | 1996-02-06 |
| 5306895 | Corrosion-resistant member for chemical apparatus using halogen series corrosive gas | Ryusuke Ushikoshi, Yusuke Niori, Koichi Umemoto, Hiromichi Kobayashi, Toshihiko Honda +1 more | 1994-04-26 |
| 5280156 | Wafer heating apparatus and with ceramic substrate and dielectric layer having electrostatic chucking means | Yusuke Niori, Ryusuke Ushikoshi, Koichi Umemoto | 1994-01-18 |
| 5240170 | Method for bonding lead of IC component with electrode | Kazuto Nishida, Yoshifumi Kitayama, Keiji Saeki | 1993-08-31 |
| 5231690 | Wafer heaters for use in semiconductor-producing apparatus and heating units using such wafer heaters | Takao Soma, Ryusuke Ushikoshi | 1993-07-27 |