Issued Patents All Time
Showing 26–50 of 66 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7332753 | Semiconductor device, wafer and method of designing and manufacturing the same | Hiromasa Kobayashi | 2008-02-19 |
| 7148575 | Semiconductor device having bonding pad above low-k dielectric film | — | 2006-12-12 |
| 7052994 | Method for manufacturing semiconductor device, and processing system and semiconductor device | Toshiyuki Takewaki, Manabu Iguchi | 2006-05-30 |
| 6936926 | Wiring structure in a semiconductor device | Norio Okada | 2005-08-30 |
| 6890852 | Semiconductor device and manufacturing method of the same | — | 2005-05-10 |
| 6861759 | Semiconductor apparatus of which reliability of interconnections is improved and manufacturing method of the same | Masahiro Komuro, Manabu Iguchi, Takahiro Onodera, Norio Okada | 2005-03-01 |
| 6607978 | Method of making a semiconductor device with alloy film between barrier metal and interconnect | — | 2003-08-19 |
| 6573607 | Semiconductor device and manufacturing method thereof | Nobukazu Ito | 2003-06-03 |
| 6555911 | Semiconductor device and method of manufacturing interconnections thereof using copper and tungsten in predetermined ratios | Toshiyuki Takewaki, Manabu Iguchi | 2003-04-29 |
| 6514853 | Semiconductor device and a manufacturing process therefor | — | 2003-02-04 |
| 6492735 | Semiconductor device with alloy film between barrier metal and interconnect | — | 2002-12-10 |
| 6458690 | Method for manufacturing a multilayer interconnection structure | Toshiyuki Takewaki, Manabu Iguchi | 2002-10-01 |
| 6379782 | Semiconductor device formed with metal wiring on a wafer by chemical mechanical polishing, and method of manufacturing the same | Manabu Iguchi, Toshiyuki Takewaki | 2002-04-30 |
| 6372628 | Insulating film comprising amorphous carbon fluoride, a semiconductor device comprising such an insulating film, and a method for manufacturing the semiconductor device | Ko Noguchi, Shinya Ito, Noriaki Oda, Akira Matsumoto, Takashi Ishigami +5 more | 2002-04-16 |
| 6329295 | Semiconductor device capable of having amorphous carbon fluoride film of low dielectric constant as interlayer insulation material and method of manufacturing the same | Kazuhiko Endo | 2001-12-11 |
| 6309970 | Method of forming multi-level copper interconnect with formation of copper oxide on exposed copper surface | Nobukazu Ito | 2001-10-30 |
| 6297094 | Semiconductor device with salicide structure and fabrication method thereof | Masato Kawata | 2001-10-02 |
| 6277735 | Method for forming a refractory metal silicide layer | — | 2001-08-21 |
| 6274417 | Method of forming a semiconductor device | — | 2001-08-14 |
| 6271594 | Semiconductor device and method of manufacturing the same | — | 2001-08-07 |
| 6268090 | Process for manufacturing semiconductor device and exposure mask | Kazumi Sugai, Nobukazu Ito, Kazuyoshi Ueno | 2001-07-31 |
| 6241859 | Method of forming a self-aligned refractory metal silicide layer | Yoshiaki Yamada, Takashi Ishigami | 2001-06-05 |
| 6149730 | Apparatus for forming films of a semiconductor device, a method of manufacturing a semiconductor device, and a method of forming thin films of a semiconductor | Manabu Iguchi, Kazuhiko Endo | 2000-11-21 |
| 6127267 | Fabrication method of semiconductor device equipped with silicide layer | Takashi Ishigami, Yoshiaki Yamada, Shinichi Watanuki | 2000-10-03 |
| 6104092 | Semiconductor device having amorphous carbon fluoride film of low dielectric constant as interlayer insulation material | Kazuhiko Endo | 2000-08-15 |