Issued Patents All Time
Showing 26–50 of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7745937 | Semiconductor device and method of manufacturing the same | Tatsuya Usami, Koichi Ohto | 2010-06-29 |
| 7741214 | Method of forming a semiconductor device featuring copper wiring layers of different widths having metal capping layers of different thicknesses formed thereon | Kazuyoshi Ueno | 2010-06-22 |
| 7737555 | Semiconductor method having silicon-diffused metal wiring layer | Koichi Ohto, Tatsuya Usami, Nobuyuki Yamanishi | 2010-06-15 |
| 7728432 | Narrow and wide copper interconnections composed of (111), (200) and (511) surfaces | Hiroyuki Kunishima | 2010-06-01 |
| 7692265 | Fuse and seal ring | Noriaki Oda | 2010-04-06 |
| 7687917 | Single damascene structure semiconductor device having silicon-diffused metal wiring layer | Koichi Ohto, Tatsuya Usami, Nobuyuki Yamanishi | 2010-03-30 |
| 7674704 | Method of manufacturing a semiconductor device having an interconnect structure that increases in impurity concentration as width increases | — | 2010-03-09 |
| 7633138 | Semiconductor device and method of manufacturing the same | Takeshi Toda | 2009-12-15 |
| 7601640 | Method of manfacturing semiconductor device | Manabu Iguchi, Daisuke Oshida, Hironori Toyoshima, Masayuki Hiroi, Takuji Onuma +6 more | 2009-10-13 |
| 7521802 | Semiconductor device having a refractory metal containing film and method for manufacturing the same | Mari Watanabe | 2009-04-21 |
| 7514352 | Method of manufacturing a semiconductor device having an interconnect structure that increases in impurity concentration as width increases | — | 2009-04-07 |
| 7508082 | Semiconductor device and method of manufacturing the same | Noriaki Oda | 2009-03-24 |
| 7479700 | Semiconductor device featuring copper wiring layers of different widths having metal capping layers of different thickness formed thereon, and method for manufacturing the same | Kazuyoshi Ueno | 2009-01-20 |
| 7476611 | Semiconductor device and manufacturing method thereof | Hiroyuki Kunishima | 2009-01-13 |
| 7358609 | Semiconductor device | Manabu Iguchi | 2008-04-15 |
| 7327031 | Semiconductor device and method of manufacturing the same | Noriaki Oda | 2008-02-05 |
| 7312535 | Semiconductor device having an anti-oxidizing layer that inhibits corrosion of an interconnect layer | Noriaki Oda, Yorinobu Kunimune | 2007-12-25 |
| 7274104 | Semiconductor device having an interconnect that increases in impurity concentration as width increases | — | 2007-09-25 |
| 7229921 | Semiconductor device and manufacturing method for the same | Nobuo Hironaga, Hiroyuki Kunishima, Yoshiaki Yamamoto | 2007-06-12 |
| 7052994 | Method for manufacturing semiconductor device, and processing system and semiconductor device | Yoshihisa Matsubara, Manabu Iguchi | 2006-05-30 |
| 6949832 | Semiconductor device including dissimilar element-diffused metal layer and manufacturing method thereof | Hiroyuki Kunishima | 2005-09-27 |
| 6890864 | Semiconductor device fabricating method and treating liquid | Hidemitsu Aoki, Kenichi Nakabeppu, Hiroaki Tomimori, Nobuo Hironaga, Hiroyuki Kunishima | 2005-05-10 |
| 6555911 | Semiconductor device and method of manufacturing interconnections thereof using copper and tungsten in predetermined ratios | Yoshihisa Matsubara, Manabu Iguchi | 2003-04-29 |
| 6458690 | Method for manufacturing a multilayer interconnection structure | Yoshihisa Matsubara, Manabu Iguchi | 2002-10-01 |
| 6391774 | Fabrication process of semiconductor device | — | 2002-05-21 |