Issued Patents All Time
Showing 26–34 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7940143 | Vertical transmission line structure that includes bump elements for flip-chip mounting | Wei-Cheng Wu, Ruey-Bing Hwang, Li-Han Hsu | 2011-05-10 |
| 7847410 | Interconnect of group III-V semiconductor device and fabrication method for making the same | Cheng-Shih Lee, Huang-Choung Chang | 2010-12-07 |
| 7420227 | Cu-metalized compound semiconductor device | Shang-Wen Chang, Cheng-Shih Lee | 2008-09-02 |
| 7368822 | Copper metalized ohmic contact electrode of compound device | Cheng-Shih Lee, Ke-Shian Chen | 2008-05-06 |
| 7259084 | Growth of GaAs epitaxial layers on Si substrate by using a novel GeSi buffer layer | Guangli Luo, Tsung-Hsi Yang, Chung-Yen Chang | 2007-08-21 |
| 6943068 | Method for fabricating nanometer gate in semiconductor device using thermally reflowed resist technology | Huang-Ming Lee | 2005-09-13 |
| 6803329 | Method for low temperature liquid-phase deposition and method for cleaning liquid-phase deposition apparatus | Muh-Wang Liang, Shih-Ming Chiang, Chih-Yuan Tseng, Pang-Min Chiang | 2004-10-12 |
| 5766967 | Method for fabricating a submicron T-shaped gate | Yeong-Lin Lai, Hung-Ping D. Yang, Chun-Yen Chang, Kazumitsu Nakamura, Rico Chang | 1998-06-16 |
| 5744734 | Fabrication process for high temperature aluminum alloys by squeeze casting | Chih-Chao Yang | 1998-04-28 |