Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12389520 | Plasma source, and atomic clock employing plasma source | Yuuichi KURASHIMA, Taisei Motomura, Shinya Yanagimachi, Eiji HIGURASHI, Takashi MATSUMAE | 2025-08-12 |
| 12027440 | Composite having diamond crystal base | Takashi MATSUMAE, Hitoshi Umezawa, Yuuichi KURASHIMA | 2024-07-02 |
| 10189203 | Method for forming micropattern of polyimide using imprinting | Sung Won YOUN, Sang Cheon Park, Hiroshi Hiroshima, Kenta Suzuki | 2019-01-29 |
| 10112376 | Device manufactured by room-temperature bonding, device manufacturing method, and room-temperature bonding apparatus | Jun Utsumi, Takayuki Goto, Kensuke Ide, Masahiro Funayama | 2018-10-30 |
| 9929311 | Semiconductor light emitting element and method for producing the same | Yukio Kashima, Eriko Matsuura, Mitsunori Kokubo, Takaharu Tashiro, Takafumi Ookawa +5 more | 2018-03-27 |
| 9761479 | Manufacturing method for semiconductor substrate | Ko IMAOKA, Motoki Kobayashi, Hidetsugu Uchida, Kuniaki Yagi, Takamitsu Kawahara +5 more | 2017-09-12 |
| 9751754 | Package formation method and MEMS package | Yuuichi KURASHIMA, Atsuhiko MAEDA | 2017-09-05 |
| 9580306 | Room temperature bonding apparatus and room temperature bonding method | Masato Kinouchi, Takayuki Goto, Takeshi Tsuno, Jun Utsumi, Kensuke Ide +3 more | 2017-02-28 |
| 9349918 | Light emitting element and method for manufacturing same | Yukio Kashima, Eriko Matsuura, Hiromi Nishihara, Takaharu Tashiro, Takafumi Ookawa +5 more | 2016-05-24 |
| 9112035 | Semiconductor substrate, field-effect transistor, integrated circuit, and method for fabricating semiconductor substrate | Hisashi Yamada, Masahiko Hata, Masafumi Yokoyama, Mitsuru Takenaka, Shinichi Takagi +2 more | 2015-08-18 |
| 8936998 | Manufcaturing method for room-temperature substrate bonding | Jun Utsumi, Takayuki Goto, Kensuke Ide, Masahiro Funayama | 2015-01-20 |
| 8608048 | Room-temperature bonding method and room-temperature bonding apparatus including sputtering | Takayuki Goto, Jun Utsumi, Kensuke Ide, Masahiro Funayama | 2013-12-17 |
| 8602289 | Room temperature bonding using sputtering | Takayuki Goto, Jun Utsumi, Kensuke Ide, Masahiro Funayama | 2013-12-10 |
| 8099982 | Method of molding glass parts and molding apparatus | Masaharu Takahashi, Ryutaro Maeda, Shinichi Miyazawa | 2012-01-24 |
| 7378728 | Electronic component mounting package and package assembled substrate | Hideki Ito, Masanori Hongo, Masami Fukuyama, Hiroyuki Taguchi | 2008-05-27 |
| 7331092 | Method and manufacturing surface acoustic wave device | Michio Miura, Takashi Matsuda, Yoshio Satoh, Masanori Ueda | 2008-02-19 |
| 7040963 | Table of wafer polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor wafer | Yuji Okuda, Naoyuki Jimbo, Kazutaka MAJIMA, Masahiro Tsuji, Shigeharu Ishikawa +1 more | 2006-05-09 |
| 6509633 | IC package capable of accommodating discrete devices | — | 2003-01-21 |
| 6280802 | Method of forming film of ultrafine particles | Jun Akedo | 2001-08-28 |
| 5396039 | Process for assembling piping or components by TIG welding | Henri Chevrel, Taeko Hattori, Eiichi Ozawa, Jean-Marie Friedt | 1995-03-07 |