Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7777314 | Electronic component mounting package and package assembled substrate | Masanori Hongo | 2010-08-17 |
| 7432590 | Ceramic package, assembled substrate, and manufacturing method therefor | Natsuyo Nagano, Takashi Ogura, Masanori Hongo | 2008-10-07 |
| 7378728 | Electronic component mounting package and package assembled substrate | Hideki Ito, Masanori Hongo, Hiroyuki Taguchi, Hideki Takagi | 2008-05-27 |
| 7218002 | Electronic device and intermediate product of electronic device | Natsuyo Nagano, Masanori Hongo, Takashi Ogura | 2007-05-15 |