Issued Patents All Time
Showing 76–100 of 161 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11094662 | Semiconductor assembly and method of manufacturing the same | — | 2021-08-17 |
| 11086222 | Method of manufacturing semiconductor structure | Yu-Mei Ni, Shih-Yi Liu | 2021-08-10 |
| 11063006 | Semiconductor device structure with fine patterns forming varied height spacer and method for forming the same | — | 2021-07-13 |
| 11063012 | Semiconductor structure having buffer under bump pad and manufacturing method thereof | — | 2021-07-13 |
| 11043469 | Method of forming three dimensional semiconductor structure | — | 2021-06-22 |
| 11031348 | Semiconductor structure | Tse-Yao Huang | 2021-06-08 |
| 10978338 | Semiconductor device and manufacture method thereof | — | 2021-04-13 |
| 10950564 | Methods of forming microelectronic devices having a patterned surface structure | Tieh-Chiang Wu | 2021-03-16 |
| 10950538 | Semiconductor structure and manufacturing method thereof | — | 2021-03-16 |
| 10937749 | Methods of forming microelectronic devices including dummy dice | Neng-Tai Shih | 2021-03-02 |
| 10910357 | Semiconductor package including hybrid bonding structure and method for preparing the same | — | 2021-02-02 |
| 10903110 | Method of forming fine interconnection for a semiconductor device | — | 2021-01-26 |
| 10872852 | Wafer level package utilizing molded interposer | — | 2020-12-22 |
| 10833052 | Microelectronic package utilizing embedded bridge through-silicon-via interconnect component and related methods | — | 2020-11-10 |
| 10825783 | Semiconductor packages and devices | Tieh-Chiang Wu | 2020-11-03 |
| 10825799 | Semiconductor structure | — | 2020-11-03 |
| 10818625 | Electronic device | — | 2020-10-27 |
| 10818536 | Microelectronic devices including redistribution layers | Hsu Chiang, Neng-Tai Shih | 2020-10-27 |
| 10811309 | Semiconductor structure and fabrication thereof | Chih-Ching Lin | 2020-10-20 |
| 10770424 | Semiconductor structure and method of manufacturing thereof | — | 2020-09-08 |
| 10763262 | Method of preparing semiconductor structure | — | 2020-09-01 |
| 10763199 | Semiconductor package structure and method for preparing the same | — | 2020-09-01 |
| 10685845 | Method for preparing a semiconductor structure | — | 2020-06-16 |
| 10629522 | Semiconductor package and method for fabricating the same | — | 2020-04-21 |
| 10566229 | Microelectronic package structures including redistribution layers | Hsu Chiang, Neng-Tai Shih | 2020-02-18 |