Issued Patents All Time
Showing 126–150 of 161 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10090154 | Method for preparing a semiconductor structure having second line patterns and third line patterns formed over first line patterns | Jeng-Ping Lin, Chiang-Lin Shih | 2018-10-02 |
| 10056338 | Methods of forming semiconductor packages including molding semiconductor chips of the semiconductor packages | Tieh-Chiang Wu | 2018-08-21 |
| 10049877 | Patterning method | — | 2018-08-14 |
| 10043769 | Semiconductor devices including dummy chips | Neng-Tai Shih | 2018-08-07 |
| 10026680 | Semiconductor package and fabrication method thereof | — | 2018-07-17 |
| 10008461 | Semiconductor structure having a patterned surface structure and semiconductor chips including such structures | Tieh-Chiang Wu | 2018-06-26 |
| 9922845 | Semiconductor package and fabrication method thereof | — | 2018-03-20 |
| 9922924 | Interposer and semiconductor package | — | 2018-03-20 |
| 9916999 | Methods of fabricating a semiconductor package structure including at least one redistribution layer | Hsu Chiang, Neng-Tai Shih | 2018-03-13 |
| 9786586 | Semiconductor package and fabrication method thereof | — | 2017-10-10 |
| 9786514 | Semiconductor package with sidewall-protected RDL interposer | Tieh-Chiang Wu | 2017-10-10 |
| 9761540 | Wafer level package and fabrication method thereof | — | 2017-09-12 |
| 9761559 | Semiconductor package and fabrication method thereof | Tieh-Chiang Wu | 2017-09-12 |
| 9748184 | Wafer level package with TSV-less interposer | Hsu Chiang | 2017-08-29 |
| 9721923 | Semiconductor package with multiple coplanar interposers | — | 2017-08-01 |
| 9704790 | Method of fabricating a wafer level package | Tieh-Chiang Wu | 2017-07-11 |
| 9613895 | Semiconductor package with double side molding | — | 2017-04-04 |
| 9607967 | Multi-chip semiconductor package with via components and method for manufacturing the same | — | 2017-03-28 |
| 9576931 | Method for fabricating wafer level package | — | 2017-02-21 |
| 9570369 | Semiconductor package with sidewall-protected RDL interposer and fabrication method thereof | Tieh-Chiang Wu | 2017-02-14 |
| 9520333 | Wafer level package and fabrication method thereof | Neng-Tai Shih, Hsu Chiang | 2016-12-13 |
| 9449953 | Package-on-package assembly and method for manufacturing the same | Neng-Tai Shih | 2016-09-20 |
| 9449935 | Wafer level package and fabrication method thereof | Tieh-Chiang Wu | 2016-09-20 |
| 9437583 | Package-on-package assembly and method for manufacturing the same | Neng-Tai Shih | 2016-09-06 |
| 9397048 | Semiconductor structure and manufacturing method thereof | Tieh-Chiang Wu | 2016-07-19 |