Issued Patents All Time
Showing 26–50 of 161 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735540 | Apparatuses including dummy dice | Neng-Tai Shih | 2023-08-22 |
| 11728316 | Method for fabricating semiconductor device with heat dissipation features | — | 2023-08-15 |
| 11728277 | Method for manufacturing semiconductor structure having via through bonded wafers | — | 2023-08-15 |
| 11710693 | Wafer level package utilizing molded interposer | — | 2023-07-25 |
| 11705380 | Method for fabricating semiconductor device with protection layers | Tse-Yao Huang | 2023-07-18 |
| 11658070 | Method of forming semiconductor structure | Chiang-Lin Shih | 2023-05-23 |
| 11658063 | Method for preparing semiconductor device structure with air gap | — | 2023-05-23 |
| 11646299 | Method of manufacturing a semiconductor package including a first sub-package stacked atop a second sub-package | — | 2023-05-09 |
| 11646292 | Method for fabricating semiconductor device with re-fill layer | — | 2023-05-09 |
| 11640948 | Microelectronic devices and apparatuses having a patterned surface structure | Tieh-Chiang Wu | 2023-05-02 |
| 11640945 | Method of forming a semiconductor structure including forming a buffer structure over a metal layer | — | 2023-05-02 |
| 11621341 | Semiconductor device and method for fabricating the same | — | 2023-04-04 |
| 11610833 | Conductive feature with non-uniform critical dimension and method of manufacturing the same | Jheng-Ting Jhong | 2023-03-21 |
| 11605612 | Method of manufacturing semiconductor package | — | 2023-03-14 |
| 11605596 | Semiconductor device having through silicon vias | — | 2023-03-14 |
| 11587901 | Semiconductor device with redistribution structure and method for fabricating the same | — | 2023-02-21 |
| 11574891 | Semiconductor device with heat dissipation unit and method for fabricating the same | — | 2023-02-07 |
| 11521916 | Method for fabricating semiconductor device with etch stop layer having greater thickness | — | 2022-12-06 |
| 11502025 | Semiconductor device with etch stop layer having greater thickness and method for fabricating the same | — | 2022-11-15 |
| 11502038 | Semiconductor structure having via through bonded wafers and manufacturing method thereof | — | 2022-11-15 |
| 11476200 | Semiconductor package structure having stacked die structure | — | 2022-10-18 |
| 11469173 | Method of manufacturing a semiconductor structure | — | 2022-10-11 |
| 11469210 | Semiconductor package with multiple coplanar interposers | — | 2022-10-11 |
| 11462453 | Semiconductor device with protection layers and method for fabricating the same | Tse-Yao Huang | 2022-10-04 |
| 11450556 | Semiconductor structure | Chih-Ching Lin | 2022-09-20 |