Issued Patents All Time
Showing 51–75 of 161 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355464 | Semiconductor device structure with bottle-shaped through silicon via and method for forming the same | Tse-Yao Huang | 2022-06-07 |
| 11342333 | Semiconductor device | Tse-Yao Huang | 2022-05-24 |
| 11329028 | Semiconductor device with recessed pad layer and method for fabricating the same | — | 2022-05-10 |
| 11322458 | Semiconductor structure including a first substrate and a second substrate and a buffer structure in the second substrate | — | 2022-05-03 |
| 11315904 | Semiconductor assembly and method of manufacturing the same | — | 2022-04-26 |
| 11315869 | Semiconductor device with decoupling unit and method for fabricating the same | Tse-Yao Huang | 2022-04-26 |
| 11309312 | Semiconductor device | — | 2022-04-19 |
| 11309254 | Semiconductor device having through silicon vias and method of manufacturing the same | — | 2022-04-19 |
| 11302629 | Semiconductor device with composite passivation structure and method for preparing the same | — | 2022-04-12 |
| 11302608 | Semiconductor device with protection layers and method for fabricating the same | Tse-Yao Huang | 2022-04-12 |
| 11289370 | Liner for through-silicon via | Sheng-Fu Huang | 2022-03-29 |
| 11282781 | Semiconductor device and method for fabricating the same | Tse-Yao Huang | 2022-03-22 |
| 11251128 | Semiconductor device structure with air gap for reducing capacitive coupling | — | 2022-02-15 |
| 11239217 | Semiconductor package including a first sub-package stacked atop a second sub-package | — | 2022-02-01 |
| 11222811 | Semiconductor device structure with air gap and method for forming the same | — | 2022-01-11 |
| 11217525 | Semiconductor structure and method of forming the same | Sheng-Fu Huang | 2022-01-04 |
| 11211287 | Semiconductor device and method for fabricating the same | Tse-Yao Huang | 2021-12-28 |
| 11195823 | Semiconductor package and manufacturing method thereof | — | 2021-12-07 |
| 11189523 | Semiconductor structure and fabrication method thereof | Mao-Ying Wang, Hung-Mo Wu | 2021-11-30 |
| 11189563 | Semiconductor structure and manufacturing method thereof | — | 2021-11-30 |
| 11177194 | Semiconductor device with interconnect structure and method for preparing the same | — | 2021-11-16 |
| 11133251 | Semiconductor assembly having T-shaped interconnection and method of manufacturing the same | — | 2021-09-28 |
| 11127632 | Semiconductor device with conductive protrusions and method for fabricating the same | — | 2021-09-21 |
| 11127628 | Semiconductor device with connecting structure having a step-shaped conductive feature and method for fabricating the same | — | 2021-09-21 |
| 11120996 | Method for preparing a semiconductor structure | — | 2021-09-14 |