Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12308310 | Method for forming semiconductor interconnection structure against stress migration | — | 2025-05-20 |
| 11742242 | Method for manufacturing through-silicon via with liner | Shing-Yih Shih | 2023-08-29 |
| 11610996 | Semiconductor structure and method of forming the same | Chung-Hsun Huang | 2023-03-21 |
| 11383195 | Device for capturing particles | Tsung-Jen Ho, Yen-Chun Liu, Chun-Yi Chou | 2022-07-12 |
| 11387207 | Method for fabricating semiconductor device including etching an edge portion of a bonding layer by using an etching mask | — | 2022-07-12 |
| 11289370 | Liner for through-silicon via | Shing-Yih Shih | 2022-03-29 |
| 11217525 | Semiconductor structure and method of forming the same | Shing-Yih Shih | 2022-01-04 |
| 10991828 | Semiconductor structure and method of forming the same | Chung-Hsun Huang | 2021-04-27 |
| 5193565 | Rib linkage joint | — | 1993-03-16 |
| 5020558 | Automatic umbrella having stable extending and folding structure | — | 1991-06-04 |