Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9653297 | Method of manufacturing silicon carbide semiconductor device by forming metal-free protection film | Taku Horii | 2017-05-16 |
| 7887527 | Absorbent article and inner absorbent article | Akifumi Hayashi, Yoshinori Katayama | 2011-02-15 |
| 7013544 | Machine tool and pallet changer for machine tool | Hiroshi Yasuda | 2006-03-21 |
| 5846870 | Method of measuring a semiconductor device and a method of making a semiconductor device | Ryo Obara | 1998-12-08 |
| 5474615 | Method for cleaning semiconductor devices | Kenji Kawai, Moriaki Akazawa, Takahiro Maruyama, Toshiaki Ogawa | 1995-12-12 |
| 5318654 | Apparatus for cleaning a substrate with metastable helium | Takahiro Maruyama, Toshiaki Ogawa, Hiroshi Morita, Kenji Kawai | 1994-06-07 |
| 5306671 | Method of treating semiconductor substrate surface and method of manufacturing semiconductor device including such treating method | Toshiaki Ogawa, Hiroshi Morita, Kenji Kawai, Moriaki Akazawa | 1994-04-26 |
| 5246532 | Plasma processing apparatus | — | 1993-09-21 |
| 5240559 | Dry etching method of copper or copper alloy interconnection layer employing plasma of an iodine compound | — | 1993-08-31 |
| 5213658 | Plasma processing method | — | 1993-05-25 |
| 5147465 | Method of cleaning a surface | Takahiro Maruyama, Toshiaki Ogawa, Hiroshi Morita, Kenji Kawai | 1992-09-15 |
| 5038013 | Plasma processing apparatus including an electromagnet with a bird cage core | Moriaki Akazawa, Takahiro Maruyama, Toshiaki Ogawa, Hiroshi Morita | 1991-08-06 |
| 4982138 | Semiconductor wafer treating device utilizing a plasma | Nobuo Fujiwara, Kenji Kawai, Moriaki Akazawa, Teruo Shibano, Kyusaku Nishioka | 1991-01-01 |
| 4915979 | Semiconductor wafer treating device utilizing ECR plasma | Nobuo Fujiwara, Kyusaku Nishioka, Moriaki Akazawa, Teruo Shibano, Kenji Kawai | 1990-04-10 |
| 4891095 | Method and apparatus for plasma treatment | Kyusaku Nishioka | 1990-01-02 |