Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6589815 | Method of manufacturing semiconductor device with plated heat sink by laser cutting | Hiroshi Matsuoka, Kazuo Hayashi | 2003-07-08 |
| 6537057 | Mold clamping apparatus for injection molding machine | Jun Koike | 2003-03-25 |
| 6533573 | Mold clamping apparatus for injection molding machine | Jun Koike | 2003-03-18 |
| 6500325 | Method of plating semiconductor wafer and plated semiconductor wafer | Katsuya Kosaki | 2002-12-31 |
| 6391770 | Method of manufacturing semiconductor device | Katsuya Kosaki, Takao Ishida | 2002-05-21 |
| 6332355 | Method of estimating a life of ball screw included in electric injection molding machine and life estimating system | Tsuginobu Totani, Kiyoshi Sasaki, Akira Kanda, Yukio Iimura, Jun Koike +2 more | 2001-12-25 |
| 6329671 | Semiconductor device and method of manufacturing the same | Kazuo Hayashi, Shozui Takeno | 2001-12-11 |
| 6325954 | Method of controlling electric injection unit of injection molding machine | Kiyoshi Sasaki, Fumiyuki Kato, Tsuginobu Totani, Fukio Iimura, Jun Koike +1 more | 2001-12-04 |
| 6309203 | Injection apparatus for injection molding machine | Jun Koike | 2001-10-30 |
| 6270333 | Mold clamping apparatus for injection molding machine | Jun Koike | 2001-08-07 |
| 6268619 | Semiconductor device with high aspect ratio via hole including solder repelling coating | Katsuya Kosaki, Takao Ishida | 2001-07-31 |
| 6245596 | Method of producing semiconductor device with heat dissipation metal layer and metal projections | Katsuya Kosaki, Hiroshi Matsuoka | 2001-06-12 |
| 6210554 | Method of plating semiconductor wafer and plated semiconductor wafer | Katsuya Kosaki | 2001-04-03 |
| 6157077 | Semiconductor device with plated heat sink and partially plated side surfaces | Hiroshi Matsuoka, Kazuo Hayashi | 2000-12-05 |
| 6144182 | Motor control method for injection molding machine and motor controller for carrying out the same | Tsuginobu Totani, Fumiyuki Katoh, Kiyoshi Sasaki, Yukio Iimura, Jun Koike +1 more | 2000-11-07 |
| 6136668 | Method of dicing semiconductor wafer | Kazuo Hayashi, Shozui Takeno | 2000-10-24 |
| 6132198 | Clamping apparatus for injection molding machine | Jun Koike | 2000-10-17 |
| 6109036 | Sealed hydraulic intensifier | Jun Koike | 2000-08-29 |
| 6059556 | Injection apparatus for injection molding machine | Jun Koike | 2000-05-09 |
| 6050804 | Clamping apparatus for injection molding machine | Jun Koike | 2000-04-18 |
| 6033540 | Plating apparatus for plating a wafer | Katsuya Kosaki | 2000-03-07 |
| 6008537 | Semiconductor device with heat dissipation metal layer and metal projections | Katsuya Kosaki, Hiroshi Matsuoka | 1999-12-28 |
| 5853559 | Apparatus for electroplating a semiconductor substrate | Katsuya Kosaki | 1998-12-29 |
| 5457072 | Process for dicing a semiconductor wafer having a plated heat sink using a temporary substrate | Kouji Aono, Sinichi Sakamoto | 1995-10-10 |