Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6992016 | Chemical processing method, and method of manufacturing semiconductor device | Takeo Nakamoto, Masaru Kinugawa | 2006-01-31 |
| 6849865 | Chemical processor | Takeo Nakamoto, Masaru Kinugawa | 2005-02-01 |
| 6603190 | Semiconductor device | Hirofumi Nakano, Tetsuo Kunii | 2003-08-05 |
| 6500325 | Method of plating semiconductor wafer and plated semiconductor wafer | Masahiro Tamaki | 2002-12-31 |
| 6391770 | Method of manufacturing semiconductor device | Masahiro Tamaki, Takao Ishida | 2002-05-21 |
| 6335265 | Method for manufacturing semiconductor device and semiconductor device | Hirofumi Nakano, Tetsuo Kunii | 2002-01-01 |
| 6268619 | Semiconductor device with high aspect ratio via hole including solder repelling coating | Masahiro Tamaki, Takao Ishida | 2001-07-31 |
| 6245596 | Method of producing semiconductor device with heat dissipation metal layer and metal projections | Masahiro Tamaki, Hiroshi Matsuoka | 2001-06-12 |
| 6210554 | Method of plating semiconductor wafer and plated semiconductor wafer | Masahiro Tamaki | 2001-04-03 |
| 6033540 | Plating apparatus for plating a wafer | Masahiro Tamaki | 2000-03-07 |
| 6008537 | Semiconductor device with heat dissipation metal layer and metal projections | Masahiro Tamaki, Hiroshi Matsuoka | 1999-12-28 |
| 5998238 | Method of fabricating semiconductor device | — | 1999-12-07 |
| 5872396 | Semiconductor device with plated heat sink | — | 1999-02-16 |
| 5853559 | Apparatus for electroplating a semiconductor substrate | Masahiro Tamaki | 1998-12-29 |
| 5800667 | Apparatus for adhering wafer to supporting substrate | Takeshi Kuragaki | 1998-09-01 |
| 5786634 | Semiconductor device | Kiyoshi Nishikawa, Mitsunori Nakatani | 1998-07-28 |
| 5770468 | Process for mounting a semiconductor chip to a chip carrier by exposing a solder layer to a reducing atmosphere | — | 1998-06-23 |
| 5483092 | Semiconductor device having a via-hole with a void area for reduced cracking | — | 1996-01-09 |
| 5441629 | Apparatus and method of electroplating | — | 1995-08-15 |
| 5338967 | Semiconductor device structure with plated heat sink and supporting substrate | — | 1994-08-16 |
| 5272111 | Method for manufacturing semiconductor device contact | — | 1993-12-21 |
| 5200641 | Semiconductor device structure including bending-resistant radiating layer | — | 1993-04-06 |