Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5457072 | Process for dicing a semiconductor wafer having a plated heat sink using a temporary substrate | Masahiro Tamaki, Kouji Aono | 1995-10-10 |
SS
Sinichi Sakamoto
Overall (All Time): #3,781,716 of 4,157,543Top 95%
1
Patents All Time