Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5457072 | Process for dicing a semiconductor wafer having a plated heat sink using a temporary substrate | Masahiro Tamaki, Sinichi Sakamoto | 1995-10-10 |
| 4944032 | Multiplex signal processing apparatus | Sadashi Kageyama, Yoshio Abe, Yoshio Yasumoto, Shuji Inoue, Hitoshi Takai +3 more | 1990-07-24 |
| 4882614 | Multiplex signal processing apparatus | Sadashi Kageyama, Yoshio Abe, Yoshio Yasumoto, Shuji Inoue, Hitoshi Takai +3 more | 1989-11-21 |
| 4723309 | Optical network system of bus architecture capable of rapidly detecting collision at each communication station | Motomu Mochizuki, Souichirou Miyano, Shigeru Sho, Akio Abe | 1988-02-02 |