Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6972392 | Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring board | Miki Kurosawa, Tsukasa Fukushima, Masanori Mizuno, Masaharu Moriyasu, Masayuki Kaneko | 2005-12-06 |
| 6875951 | Laser machining device | Masahiko Sakamoto, Yasuhiko Iwai, Toshiyuki Hokodate, Miki Kurosawa | 2005-04-05 |
| 6690024 | Laser inspection apparatus | Koji Funaoka, Masahiko Sakamoto, Hiroshi Sasai | 2004-02-10 |
| 6633376 | Apparatus for inspecting a printed circuit board | Satoshi Nishida, Masanori Mizuno, Miki Kurosawa, Masaharu Moriyasu | 2003-10-14 |
| 6373026 | Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring board | Miki Kurosawa, Tsukasa Fukushima, Masanori Mizuno, Masaharu Moriyasu, Masayuki Kaneko | 2002-04-16 |
| 6329671 | Semiconductor device and method of manufacturing the same | Masahiro Tamaki, Kazuo Hayashi | 2001-12-11 |
| 6136668 | Method of dicing semiconductor wafer | Masahiro Tamaki, Kazuo Hayashi | 2000-10-24 |
| 5585018 | Laser cutting method eliminating defects in regions where cutting conditions are changed | Masaru Kanaoka, Homare Mori, Takayuki Yuyama | 1996-12-17 |
| 5532434 | Insulated wire | Masaharu Moriyasu, Kazumichi Machida, Seiji Yasunaga | 1996-07-02 |
| 5178725 | Method for working ceramic material | Mari Yoshimura, Kohei Murakami, Masaharu Moriyasu | 1993-01-12 |