RD

Ross S. Dando

Micron: 58 patents #293 of 6,345Top 5%
RR Round Rock Research: 3 patents #66 of 239Top 30%
AI Aptina Imaging: 1 patents #187 of 332Top 60%
📍 Nampa, ID: #9 of 306 inventorsTop 3%
🗺 Idaho: #204 of 8,810 inventorsTop 3%
Overall (All Time): #36,753 of 4,157,543Top 1%
62
Patents All Time

Issued Patents All Time

Showing 51–62 of 62 patents

Patent #TitleCo-InventorsDate
6677250 CVD apparatuses and methods of forming a layer over a semiconductor substrate Philip Campbell, Craig M. Carpenter, Kevin Hamer 2004-01-13
6620253 Engagement mechanism for semiconductor substrate deposition process kit hardware Craig M. Carpenter, Philip Campbell, Allen Mardian, Gurtej S. Sandhu 2003-09-16
6613587 Method of replacing at least a portion of a semiconductor substrate deposition chamber liner Craig M. Carpenter, Philip Campbell, Allen Mardian, Gurtej S. Sandhu 2003-09-02
6545604 Methods for electronic tracking of units originating from a common source, and assemblies comprising transponders attached to meat spikes Mark E. Tuttle 2003-04-08
6494305 Carcass-tracking apparatus housing carcass-tracking apparatus and carcass-tracking methods Donald L. Black 2002-12-17
6373391 Devices for sensing changes in environments proximate the devices, devices for sensing termites, and methods for sensing termites Rickie C. Lake, Mark E. Tuttle 2002-04-16
6166637 Apparatuses for electronic identification of a plurality of passing units and methods of electronic identification of a plurality of passing units Scott R. Cyr 2000-12-26
6161281 Battery mounting apparatuses, electronic devices, and methods of forming electrical connections Rickie C. Lake, Krishna Kumar 2000-12-19
6074896 Method of processing semiconductor material wafers and method of forming flip chips and semiconductor chips 2000-06-13
6051875 Semiconductor chip 2000-04-18
5978230 Battery mounting apparatuses, electronic devices, and methods of forming electrical connections Rickie C. Lake, Krishna Kumar 1999-11-02
5863813 Method of processing semiconductive material wafers and method of forming flip chips and semiconductor chips 1999-01-26