Issued Patents All Time
Showing 176–200 of 216 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6413827 | Low dielectric constant shallow trench isolation | — | 2002-07-02 |
| 6395632 | Etch stop in damascene interconnect structure and method of making | — | 2002-05-28 |
| 6383924 | Method of forming buried conductor patterns by surface transformation of empty spaces in solid state materials | Joseph E. Geusic | 2002-05-07 |
| 6377156 | High-Q inductive elements | Leonard Forbes | 2002-04-23 |
| 6376895 | High-Q inductive elements | Leonard Forbes | 2002-04-23 |
| 6376370 | Process for providing seed layers for using aluminum, copper, gold and silver metallurgy process for providing seed layers for using aluminum, copper, gold and silver metallurgy | — | 2002-04-23 |
| 6356500 | Reduced power DRAM device and method | Eugene H. Cloud, Kie Y. Ahn, Leonard Forbes, Kevin G. Donohoe, Alan R. Reinberg +3 more | 2002-03-12 |
| 6316356 | Thermal processing of metal alloys for an improved CMP process in integrated circuit fabrication | John H. Givens | 2001-11-13 |
| 6297156 | Method for enhanced filling of high aspect ratio dual damascene structures | John H. Givens | 2001-10-02 |
| 6288442 | Integrated circuit with oxidation-resistant polymeric layer | — | 2001-09-11 |
| 6284656 | Copper metallurgy in integrated circuits | — | 2001-09-04 |
| 6262486 | Conductive implant structure in a dielectric | — | 2001-07-17 |
| 6249460 | Dynamic flash memory cells with ultrathin tunnel oxides | Leonard Forbes, Luan C. Tran, Alan R. Reinberg, Joseph E. Geusic, Kie Y. Ahn +2 more | 2001-06-19 |
| 6239684 | High-Q inductive elements | Leonard Forbes | 2001-05-29 |
| 6211049 | Forming submicron integrated-circuit wiring from gold, silver, copper, and other metals | — | 2001-04-03 |
| 6208016 | Forming submicron integrated-circuit wiring from gold, silver, copper and other metals | — | 2001-03-27 |
| 6143655 | Methods and structures for silver interconnections in integrated circuits | Leonard Forbes, Kie Y. Ahn | 2000-11-07 |
| 6136689 | Method of forming a micro solder ball for use in C4 bonding process | — | 2000-10-24 |
| 6121126 | Methods and structures for metal interconnections in integrated circuits | Kie Y. Ahn, Leonard Forbes | 2000-09-19 |
| 6100176 | Methods and structures for gold interconnections in integrated circuits | Leonard Forbes, Kie Y. Ahn | 2000-08-08 |
| 6077792 | Method of forming foamed polymeric material for an integrated circuit | — | 2000-06-20 |
| 6075278 | Aluminum based alloy bridge structure and method of forming same | — | 2000-06-13 |
| 6025261 | Method for making high-Q inductive elements | Leonard Forbes | 2000-02-15 |
| 6017829 | Implanted conductor and methods of making | — | 2000-01-25 |
| 5994777 | Method and support structure for air bridge wiring of an integrated circuit | — | 1999-11-30 |