Issued Patents All Time
Showing 151–175 of 216 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6579738 | Method of alignment for buried structures formed by surface transformation of empty spaces in solid state materials | Joseph E. Geusic | 2003-06-17 |
| 6573572 | Damascene structure and method of making | — | 2003-06-03 |
| 6559076 | Method of removing free halogen from a halogenated polymer insulating layer of a semiconductor device | — | 2003-05-06 |
| 6552432 | Mask on a polymer having an opening width less than that of the opening in the polymer | — | 2003-04-22 |
| 6552424 | Angled edge connections for multichip structures | — | 2003-04-22 |
| 6541858 | Interconnect alloys and methods and apparatus using same | — | 2003-04-01 |
| 6541859 | Methods and structures for silver interconnections in integrated circuits | Leonard Forbes, Kie Y. Ahn | 2003-04-01 |
| 6534835 | Damascene structure with low dielectric constant insulating layers | — | 2003-03-18 |
| 6525413 | Die to die connection method and assemblies and packages including dice so connected | Eugene H. Cloud | 2003-02-25 |
| 6522011 | Low capacitance wiring layout and method for making same | — | 2003-02-18 |
| 6522008 | Subtractive metallization structure with low dielectric constant insulating layers | — | 2003-02-18 |
| 6509590 | Aluminum-beryllium alloys for air bridges | — | 2003-01-21 |
| 6510080 | Three terminal magnetic random access memory | — | 2003-01-21 |
| 6509258 | Etch stop in damascene interconnect structure and method of making | — | 2003-01-21 |
| 6504224 | Methods and structures for metal interconnections in integrated circuits | Kie Y. Ahn, Leonard Forbes | 2003-01-07 |
| 6495919 | Conductive implant structure in a dielectric | — | 2002-12-17 |
| 6475899 | Low capacitance wiring layout and method for making same | — | 2002-11-05 |
| 6456535 | Dynamic flash memory cells with ultra thin tunnel oxides | Leonard Forbes, Luan C. Tran, Alan R. Reinberg, Joseph E. Geusic, Kie Y. Ahn +2 more | 2002-09-24 |
| 6451683 | Damascene structure and method of making | — | 2002-09-17 |
| 6432844 | Implanted conductor and methods of making | — | 2002-08-13 |
| 6433431 | Coating of copper and silver air bridge structures | — | 2002-08-13 |
| 6433413 | Three-dimensional multichip module | — | 2002-08-13 |
| 6426289 | Method of fabricating a barrier layer associated with a conductor layer in damascene structures | — | 2002-07-30 |
| 6424034 | High performance packaging for microprocessors and DRAM chips which minimizes timing skews | Kie Y. Ahn, Leonard Forbes | 2002-07-23 |
| 6420262 | Structures and methods to enhance copper metallization | — | 2002-07-16 |