Issued Patents All Time
Showing 26–50 of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6331495 | Semiconductor structure useful in a self-aligned contact etch and method for making same | — | 2001-12-18 |
| 6287978 | Method of etching a substrate | Guy T. Blalock, Fred L. Roe | 2001-09-11 |
| 6277759 | Plasma etching methods | Guy T. Blalock, Kevin G. Donohoe | 2001-08-21 |
| 6239455 | Fuse structures | Kunal R. Parekh | 2001-05-29 |
| 6207571 | Self-aligned contact formation for semiconductor devices | Werner Juengling, Kirk D. Prall, Trung T. Doan, Guy T. Blalock, David Dickerson | 2001-03-27 |
| 6153501 | Method of reducing overetch during the formation of a semiconductor device | — | 2000-11-28 |
| 6123862 | Method of forming high aspect ratio apertures | Kevin G. Donohoe | 2000-09-26 |
| 6107178 | Methods for etching fuse openings in a semiconductor device | Kunal R. Parekh | 2000-08-22 |
| 6080672 | Self-aligned contact formation for semiconductor devices | Werner Juengling, Kirk D. Prall, Trung T. Doan, Guy T. Blalock, David Dickerson | 2000-06-27 |
| 6051501 | Method of reducing overetch during the formation of a semiconductor device | David Dickerson | 2000-04-18 |
| 6036786 | Eliminating stiction with the use of cryogenic aerosol | Ronald J. Hanestad, Gregory P. Thomes, James F. Weygand, Larry D. Zimmerman | 2000-03-14 |
| 6018184 | Semiconductor structure useful in a self-aligned contact having multiple insulation layers of non-uniform thickness | — | 2000-01-25 |
| 6015760 | Method for enhancing oxide to nitride selectivity through the use of independent heat control | Guy T. Blalock, Fred L. Roe | 2000-01-18 |
| 5994237 | Semiconductor processing methods of forming a contact opening to a semiconductor substrate | Mark E. Jost | 1999-11-30 |
| 5899749 | In situ etch process for insulating and conductive materials | Guy T. Blalock | 1999-05-04 |
| 5895262 | Methods for etching fuse openings in a semiconductor device | Kunal R. Parekh | 1999-04-20 |
| 5880036 | Method for enhancing oxide to nitride selectivity through the use of independent heat control | Guy T. Blalock, Lyle Breiner | 1999-03-09 |
| 5869403 | Semiconductor processing methods of forming a contact opening to a semiconductor substrate | Mark E. Jost | 1999-02-09 |
| 5770498 | Process for forming a diffusion barrier using an insulating spacer layer | — | 1998-06-23 |
| 5756216 | Highly selective nitride spacer etch | David J. Keller | 1998-05-26 |
| 5753565 | Method of reducing overetch during the formation of a semiconductor device | — | 1998-05-19 |
| 5700580 | Highly selective nitride spacer etch | David J. Keller | 1997-12-23 |
| 5691246 | In situ etch process for insulating and conductive materials | Guy T. Blalock | 1997-11-25 |
| 5498570 | Method of reducing overetch during the formation of a semiconductor device | — | 1996-03-12 |
| 5286344 | Process for selectively etching a layer of silicon dioxide on an underlying stop layer of silicon nitride | Guy T. Blalock, Fred L. Roe | 1994-02-15 |