Issued Patents All Time
Showing 26–50 of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7776231 | Chemical mechanical polishing slurries, their applications and method of use thereof | Andy Chunxiao Yang, Danny Zhenglong Shiao | 2010-08-17 |
| 7670902 | Method and structure for landing polysilicon contact | Hongxiu Peng | 2010-03-02 |
| 7645703 | Method and structure for aluminum chemical mechanical polishing | Chunxiao Yang, Ziru Ren, Herb He Huang | 2010-01-12 |
| 7557031 | Etch back with aluminum CMP for LCOS devices | — | 2009-07-07 |
| 7276442 | Method for forming a metallization layer | Gurtej S. Sandhu | 2007-10-02 |
| 7241692 | Method and structure for aluminum chemical mechanical polishing and protective layer | Chun Xiao Yang | 2007-07-10 |
| 7189317 | Semiconductor manufacturing system for forming metallization layer | Gurtej S. Sandhu | 2007-03-13 |
| 7126195 | Method for forming a metallization layer | Gurtej S. Sandhu | 2006-10-24 |
| RE39126 | Two-step chemical mechanical polishing process for producing flush and protruding tungsten plugs | Trung T. Doan | 2006-06-13 |
| 7052373 | Systems and slurries for chemical mechanical polishing | Andy Chunxiao Yang | 2006-05-30 |
| 6884729 | Global planarization method | Jui-Kun Lee, David Mikolas | 2005-04-26 |
| 6853474 | Process for fabricating optical switches | Vlasta Brusic | 2005-02-08 |
| 6753254 | Method for forming a metallization layer | Gurtej S. Sandhu | 2004-06-22 |
| 6633084 | Semiconductor wafer for improved chemical-mechanical polishing over large area features | Gurtej S. Sandhu | 2003-10-14 |
| 6458015 | Chemical-mechanical planarization machine and method for uniformly planarizing semiconductor wafers | Karl M. Robinson | 2002-10-01 |
| 6171952 | Methods of forming metallization layers and integrated circuits containing such | Gurtej S. Sandhu | 2001-01-09 |
| 6143123 | Chemical-mechanical planarization machine and method for uniformly planarizing semiconductor wafers | Karl M. Robinson | 2000-11-07 |
| 6144095 | Metallization layer | Gurtej S. Sandhu | 2000-11-07 |
| 6027997 | Method for chemical mechanical polishing a semiconductor device using slurry | Jeffrey Hanson, Jeffrey L. Klein | 2000-02-22 |
| 5868896 | Chemical-mechanical planarization machine and method for uniformly planarizing semiconductor wafers | Karl M. Robinson | 1999-02-09 |
| 5769699 | Polishing pad for chemical-mechanical polishing of a semiconductor substrate | — | 1998-06-23 |
| 5681423 | Semiconductor wafer for improved chemical-mechanical polishing over large area features | Gurtej S. Sandhu | 1997-10-28 |
| 5674352 | Process related to a modified polishing pad for polishing | Tat-Kwan Yu | 1997-10-07 |
| 5662788 | Method for forming a metallization layer | Gurtej S. Sandhu | 1997-09-02 |
| 5628862 | Polishing pad for chemical-mechanical polishing of a semiconductor substrate | Tat-Kwan Yu | 1997-05-13 |