Issued Patents All Time
Showing 51–68 of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5618381 | Multiple step method of chemical-mechanical polishing which minimizes dishing | Trung T. Doan | 1997-04-08 |
| 5531861 | Chemical-mechanical-polishing pad cleaning process for use during the fabrication of semiconductor devices | Tat-Kwan Yu | 1996-07-02 |
| 5525191 | Process for polishing a semiconductor substrate | Papu D. Maniar | 1996-06-11 |
| 5441598 | Polishing pad for chemical-mechanical polishing of a semiconductor substrate | Tat-Kwan Yu | 1995-08-15 |
| 5435772 | Method of polishing a semiconductor substrate | — | 1995-07-25 |
| 5399234 | Acoustically regulated polishing process | Tat-Kwan Yu, Jeffrey L. Klein | 1995-03-21 |
| 5354490 | Slurries for chemical mechanically polishing copper containing metal layers | Trung T. Doan | 1994-10-11 |
| 5329734 | Polishing pads used to chemical-mechanical polish a semiconductor substrate | — | 1994-07-19 |
| 5314843 | Integrated circuit polishing method | Gurtej S. Sandhu, Trung T. Doan | 1994-05-24 |
| 5300155 | IC chemical mechanical planarization process incorporating slurry temperature control | Gurtej S. Sandhu | 1994-04-05 |
| 5270263 | Process for depositing aluminum nitride (AlN) using nitrogen plasma sputtering | Sung-Cheol Kim, Trung T. Doan | 1993-12-14 |
| 5244534 | Two-step chemical mechanical polishing process for producing flush and protruding tungsten plugs | Trung T. Doan | 1993-09-14 |
| 5240552 | Chemical mechanical planarization (CMP) of a semiconductor wafer using acoustical waves for in-situ end point detection | Gurtej S. Sandhu | 1993-08-31 |
| 5232549 | Spacers for field emission display fabricated via self-aligned high energy ablation | David A. Cathey, Trung T. Doan, Tyler Lowrey, J. Brett Rolfson | 1993-08-03 |
| 5225034 | Method of chemical mechanical polishing predominantly copper containing metal layers in semiconductor processing | Trung T. Doan | 1993-07-06 |
| 5222329 | Acoustical method and system for detecting and controlling chemical-mechanical polishing (CMP) depths into layers of conductors, semiconductors, and dielectric materials | — | 1993-06-29 |
| 5209816 | Method of chemical mechanical polishing aluminum containing metal layers and slurry for chemical mechanical polishing | Trung T. Doan, Alan Laulusa | 1993-05-11 |
| 5188723 | Selective electro-deposition and circuit patterning technique | Gurtej S. Sandhu, Terry L. Gilton | 1993-02-23 |