Issued Patents All Time
Showing 51–75 of 81 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7061111 | Interconnect structure for use in an integrated circuit | — | 2006-06-13 |
| 7049009 | Silver selenide film stoichiometry and morphology control in sputter deposition | Jiutao Li, Keith Hampton | 2006-05-23 |
| 6890790 | Co-sputter deposition of metal-doped chalcogenides | Jiutao Li, Gregory Herdt, Trung T. Doan | 2005-05-10 |
| 6858465 | Elimination of dendrite formation during metal/chalcogenide glass deposition | Jiutao Li | 2005-02-22 |
| 6841478 | Method of forming a multi-layered copper bond pad for an integrated circuit | — | 2005-01-11 |
| 6825135 | Elimination of dendrite formation during metal/chalcogenide glass deposition | Jiutao Li | 2004-11-30 |
| 6800504 | Integrated circuit device and fabrication using metal-doped chalcogenide materials | Jiutao Li | 2004-10-05 |
| 6730547 | Integrated circuit device and fabrication using metal-doped chalcogenide materials | Jiutao Li | 2004-05-04 |
| 6709958 | Integrated circuit device and fabrication using metal-doped chalcogenide materials | Jiutao Li | 2004-03-23 |
| 6649519 | Reducing reflectivity on a semiconductor wafer by annealing titanium and aluminum | — | 2003-11-18 |
| 6642623 | Multi-layered copper bond pad for an integrated circuit | — | 2003-11-04 |
| 6522010 | Semiconductor constructions comprising aluminum-containing layers | — | 2003-02-18 |
| 6455424 | Selective cap layers over recessed polysilicon plugs | Steven T. Harshfield | 2002-09-24 |
| 6384480 | Formation of electrical contacts to conductive elements in the fabrication of semiconductor integrated circuits | — | 2002-05-07 |
| 6373137 | Copper interconnect for an integrated circuit and methods for its fabrication | — | 2002-04-16 |
| 6348721 | Reducing reflectivity on a semiconductor wafer by annealing titanium and aluminum | — | 2002-02-19 |
| 6348403 | Suppression of hillock formation in thin aluminum films | Kanwal K. Raina, Tianhong Zhang | 2002-02-19 |
| 6339026 | Semiconductor processing methods of polishing aluminum-comprising layers | — | 2002-01-15 |
| 6277746 | Methods of reducing corrosion of materials, methods of protecting aluminum within aluminum-comprising layers from electrochemical degradation during semiconductor processing, and semicoductor processing methods of forming aluminum-comprising lines | John Skrovan | 2001-08-21 |
| 6278188 | Semiconductor constructions comprising aluminum-containing layers | — | 2001-08-21 |
| 6261947 | Formation of electrical contacts to conductive elements in the fabrication of semiconductor integrated circuits | — | 2001-07-17 |
| 6258466 | Metallization on titanium aluminide | — | 2001-07-10 |
| 6204166 | Method for forming dual damascene structures | — | 2001-03-20 |
| 6204179 | Copper diffusion barrier, aluminum wetting layer and improved methods for filling openings in silicon substrates with copper | — | 2001-03-20 |
| 6140701 | Suppression of hillock formation in thin aluminum films | Kanwal K. Raina, Tianhong Zhang | 2000-10-31 |