Issued Patents All Time
Showing 76–81 of 81 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6110830 | Methods of reducing corrosion of materials, methods of protecting aluminum within aluminum-comprising layers from electrochemical degradation during semiconductor processing methods of forming aluminum-comprising lines | John Skrovan | 2000-08-29 |
| 6069075 | Reducing reflectivity on a semiconductor wafer by annealing aluminum and titanium | — | 2000-05-30 |
| 6016010 | Voidless metallization on titanium aluminide in an interconnect | — | 2000-01-18 |
| 5939788 | Copper diffusion barrier, aluminum wetting layer and improved methods for filling openings in silicon substrates with cooper | — | 1999-08-17 |
| 5838052 | Reducing reflectivity on a semiconductor wafer by annealing titanium and aluminum | — | 1998-11-17 |
| 5700718 | Method for increased metal interconnect reliability in situ formation of titanium aluminide | — | 1997-12-23 |