Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11887864 | Method of forming a surface-mount integrated circuit package with solder enhanced leadframe terminals | Wichai Kovitsophon, Ekgachai Kenganantanon, Pattarapon Poolsup, Watcharapong Nokde, Chanyuth Junjuewong | 2024-01-30 |
| 11127660 | Surface-mount integrated circuit package with coated surfaces for improved solder connection | Vichanart Nimibutr, Pattarapon Poolsup, Chanyuth Junjuewong | 2021-09-21 |
| 11101200 | Surface-mount integrated circuit package with coated surfaces for improved solder connection | Vichanart Nimibutr, Pattarapon Poolsup, Chanyuth Junjuewong | 2021-08-24 |
| 10211131 | Systems and methods for improved adhesion between a leadframe and molding compound in a semiconductor device | Chawalit Pinyo, Vichanart Nimibutr, Vorawat Pangwong, Kritsada Inchum | 2019-02-19 |