Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11887864 | Method of forming a surface-mount integrated circuit package with solder enhanced leadframe terminals | Rangsun Kitnarong, Ekgachai Kenganantanon, Pattarapon Poolsup, Watcharapong Nokde, Chanyuth Junjuewong | 2024-01-30 |
| 11145574 | Semiconductor device packages with electrical routing improvements and related methods | Oliver Mabutas, Ekgachai Kenganantanon, Tarapong Soontornvipart, Peerapat Bunkhem | 2021-10-12 |