Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11887864 | Method of forming a surface-mount integrated circuit package with solder enhanced leadframe terminals | Wichai Kovitsophon, Rangsun Kitnarong, Pattarapon Poolsup, Watcharapong Nokde, Chanyuth Junjuewong | 2024-01-30 |
| 11145574 | Semiconductor device packages with electrical routing improvements and related methods | Oliver Mabutas, Wichai Kovitsophon, Tarapong Soontornvipart, Peerapat Bunkhem | 2021-10-12 |
| 9263397 | Wafer mapping process control with indicator line | Matthew Gibson, Prem Na-Namchiew, Mathew Bunker | 2016-02-16 |
| 7927921 | Semiconductor die attachment method using non-conductive screen print and dispense adhesive | Surapol Sawatjeen | 2011-04-19 |