Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11887864 | Method of forming a surface-mount integrated circuit package with solder enhanced leadframe terminals | Wichai Kovitsophon, Rangsun Kitnarong, Ekgachai Kenganantanon, Watcharapong Nokde, Chanyuth Junjuewong | 2024-01-30 |
| 11127660 | Surface-mount integrated circuit package with coated surfaces for improved solder connection | Rangsun Kitnarong, Vichanart Nimibutr, Chanyuth Junjuewong | 2021-09-21 |
| 11101200 | Surface-mount integrated circuit package with coated surfaces for improved solder connection | Rangsun Kitnarong, Vichanart Nimibutr, Chanyuth Junjuewong | 2021-08-24 |