Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127660 | Surface-mount integrated circuit package with coated surfaces for improved solder connection | Rangsun Kitnarong, Pattarapon Poolsup, Chanyuth Junjuewong | 2021-09-21 |
| 11101200 | Surface-mount integrated circuit package with coated surfaces for improved solder connection | Rangsun Kitnarong, Pattarapon Poolsup, Chanyuth Junjuewong | 2021-08-24 |
| 10211131 | Systems and methods for improved adhesion between a leadframe and molding compound in a semiconductor device | Rangsun Kitnarong, Chawalit Pinyo, Vorawat Pangwong, Kritsada Inchum | 2019-02-19 |