Issued Patents All Time
Showing 26–31 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7508059 | Stacked chip package with redistribution lines | Mou-Shiung Lin, Shih-Hsiung Lin, Ying-Chih Chen, Chiu-Ming Chou | 2009-03-24 |
| 7495304 | Chip package | Mou-Shiung Lin, Shih-Hsiung Lin | 2009-02-24 |
| 7473999 | Semiconductor chip and process for forming the same | Mou-Shiung Lin, Chien-Kang Chou | 2009-01-06 |
| 7462558 | Method for fabricating a circuit component | Mou-Shiung Lin, Chiu-Ming Chou, Chien-Kang Chou | 2008-12-09 |
| 7452803 | Method for fabricating chip structure | Mou-Shiung Lin, Chiu-Ming Chou, Chien-Kang Chou | 2008-11-18 |
| 7397121 | Semiconductor chip with post-passivation scheme formed over passivation layer | Chiu-Ming Chou, Chien-Kang Chou, Ching-San Lin, Mou-Shiung Lin | 2008-07-08 |