Issued Patents All Time
Showing 26–50 of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847465 | Light emitting device with molded wavelength converting layer | Paul Scott Martin | 2017-12-19 |
| 9761765 | LED with high thermal conductivity particles in phosphor conversion layer | Mikhail Fouksman | 2017-09-12 |
| 9608016 | Method of separating a wafer of semiconductor devices | Jipu Lei, Alexander H. Nickel, Stefano Schiaffino | 2017-03-28 |
| 9537047 | Phosphor in inorganic binder for LED applications | Stein Kuiper, Paul Scott Martin | 2017-01-03 |
| 9406857 | Chip scale light emitting device with metal pillars in a molding compound formed at wafer level | Jipu Lei, Stefano Schiaffino, Alexander H. Nickel, Mooi Guan Ng, Salman Akram | 2016-08-02 |
| 9379291 | Phosphor in water glass for LEDS | Stein Kuiper | 2016-06-28 |
| 9379293 | LED with ceramic green phosphor and protected red phosphor layer | April D. Schricker, Kim Kevin Mai, Uwe Mackens, Joost Peter Andre Vogels, Aldegonda Lucia Weijers +1 more | 2016-06-28 |
| 9351348 | Laminate support film for fabrication of light emitting devices and method of fabrication | Paul Scott Martin | 2016-05-24 |
| 9337398 | Phosphor in inorganic binder for LED applications | Stein Kuiper, Paul Scott Martin | 2016-05-10 |
| 9324926 | Wavelength converted light emitting device | April D. Schricker, Kim Kevin Mai | 2016-04-26 |
| 9081167 | Lens compression molded over LED die | Robert Scott West, Paul Scott Martin, Gerard Harbers, Willem H. Smits, Robert Hendriks +1 more | 2015-07-14 |
| 8899291 | Laminating apparatus | Ryoichi Yasumoto, Kazutoshi Iwata, Kinya Kodama | 2014-12-02 |
| 8771577 | Light emitting device with molded wavelength converting layer | Paul Scott Martin | 2014-07-08 |
| 8471280 | Silicone based reflective underfill and thermal coupler | Rafael I. Aldaz, Paul Scott Martin, Michael R. Krames | 2013-06-25 |
| 8431423 | Reflective substrate for LEDS | Paul Scott Martin | 2013-04-30 |
| 8384118 | LED assembly having maximum metal support for laser lift-off of growth substrate | Stefano Schiaffino, Daniel A. Steigerwald, Mari Holcomb, Paul Scott Martin, John E. Epler | 2013-02-26 |
| 8273587 | Underfill process for flip-chip LEDs | Frederic Stephane Diana, Paul Scott Martin, Dima Simonian | 2012-09-25 |
| 8232117 | LED wafer with laminated phosphor layer | Paul Scott Martin | 2012-07-31 |
| 8203161 | Wavelength converted semiconductor light emitting device | Dmitri Simonian | 2012-06-19 |
| 7867793 | Substrate removal during LED formation | Robert Scott West, Paul Scott Martin | 2011-01-11 |
| 7858408 | LED with phosphor tile and overmolded phosphor in lens | Gerd O. Mueller, Regina B. Mueller-Mach, Robert Scott West, Paul Scott Martin, Tze-Sen Lim +1 more | 2010-12-28 |
| 7847302 | Blue LED with phosphor layer for producing white light and different phosphor in outer lens for reducing color temperature | Paul Scott Martin, Robert Scott West, Yasumasa Morita, Tewe Hiepke Heemstra | 2010-12-07 |
| 7791093 | LED with particles in encapsulant for increased light extraction and non-yellow off-state color | Ashim Shatil Haque, Ching-Hui Chen, Robert Scott West, Paul Scott Martin | 2010-09-07 |
| 7736945 | LED assembly having maximum metal support for laser lift-off of growth substrate | Stefano Schiaffino, Daniel A. Steigerwald, Mari Holcomb, Paul Scott Martin, John E. Epler | 2010-06-15 |
| 7452737 | Molded lens over LED die | Robert Scott West, Paul Scott Martin | 2008-11-18 |