Issued Patents All Time
Showing 101–125 of 145 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5517055 | Input-output drive reduction in a semiconductor integrated circuit | — | 1996-05-14 |
| 5516400 | Techniques for assembling polishing pads for chemical-mechanical polishing of silicon wafers | Thomas G. Mallon, Mark Franklin | 1996-05-14 |
| 5514616 | Depositing and densifying glass to planarize layers in semi-conductor devices based on CMOS structures | Michael D. Rostoker | 1996-05-07 |
| 5512395 | Image masks for semiconductor lithography | Michael D. Rostoker, Joe Zelayeta | 1996-04-30 |
| 5504035 | Process for solder ball interconnecting a semiconductor device to a substrate using a noble metal foil embedded interposer substrate | Michael D. Rostoker | 1996-04-02 |
| 5489804 | Flexible preformed planar structures for interposing between a chip and a substrate | — | 1996-02-06 |
| 5485243 | Afocal concentrator for low wavelength lithography, particularly for semiconductor lithography | Michael D. Rostoker, Joe Zelayeta | 1996-01-16 |
| 5478698 | Direct-write afocal electron-beam semiconductor lithography | Michael D. Rostoker, Joe Zelayeta | 1995-12-26 |
| 5477086 | Shaped, self-aligning micro-bump structures | Michael D. Rostoker | 1995-12-19 |
| 5470801 | Low dielectric constant insulation layer for integrated circuit structure and method of making same | Ashok K. Kapoor | 1995-11-28 |
| 5471091 | Techniques for via formation and filling | Roger Patrick | 1995-11-28 |
| 5468681 | Process for interconnecting conductive substrates using an interposer having conductive plastic filled vias | — | 1995-11-21 |
| 5457878 | Method for mounting integrated circuit chips on a mini-board | Michael D. Rostoker | 1995-10-17 |
| 5453583 | Interior bond pad arrangements for alleviating thermal stresses | Michael D. Rostoker, Joe Zelayeta | 1995-09-26 |
| 5441094 | Trench planarization techniques | — | 1995-08-15 |
| 5442225 | Integrated circuit having interconnects with ringing suppressing elements | Michael D. Rostoker | 1995-08-15 |
| 5438477 | Die-attach technique for flip-chip style mounting of semiconductor dies | — | 1995-08-01 |
| 5436411 | Fabrication of substrates for multi-chip modules | — | 1995-07-25 |
| 5424896 | Semiconductor package electrostatic discharge damage protection | William H. Gascoyne | 1995-06-13 |
| 5410805 | "Method and apparatus for isolation of flux materials in ""flip-chip"" manufacturing" | Vahak K. Sahakian, Conrad J. Dell'Oca | 1995-05-02 |
| 5405808 | Fluid-filled and gas-filled semiconductor packages | Michael D. Rostoker, Mark R. Schneider | 1995-04-11 |
| 5403228 | Techniques for assembling polishing pads for silicon wafer polishing | — | 1995-04-04 |
| 5393712 | Process for forming low dielectric constant insulation layer on integrated circuit structure | Michael D. Rostoker, Ashok K. Kapoor | 1995-02-28 |
| 5389194 | Methods of cleaning semiconductor substrates after polishing | Michael D. Rostoker | 1995-02-14 |
| 5384487 | Off-axis power branches for interior bond pad arrangements | Michael D. Rostoker, Joe Zelayeta | 1995-01-24 |