Issued Patents All Time
Showing 25 most recent of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12376428 | Micro light-emitting diode and micro light-emitting device with rough surface and protection layer | Zheng Wu, Shuo Yang | 2025-07-29 |
| 12237312 | Light-emitting diode packaging module | Shuning Xin, Chen-ke HSU, Aihua Cao, Junpeng SHI, Weng-Tack WONG +5 more | 2025-02-25 |
| 12230611 | Light-emitting device and display screen including the same | Yanqiu LIAO, Junpeng SHI, Shuning Xin, Chen-ke HSU, Zhen-Duan Lin +4 more | 2025-02-18 |
| 12230612 | Light-emitting diode packaging module having encapsulated array of LED chips | Shuning Xin, Zhen-Duan Lin, Yanqiu LIAO, Junpeng SHI, Aihua Cao +4 more | 2025-02-18 |
| 12106995 | Structure and method for transferring a micro semiconductor element by applying a separation force via a through hole | Zheng Wu, Shao-Ying Ting, Chen-ke HSU | 2024-10-01 |
| 12080688 | Light-emitting diode packaging module | Zhen-Duan Lin, Yanqiu LIAO, Shuning Xin, Weng-Tack WONG, Junpeng SHI +5 more | 2024-09-03 |
| 12040430 | Micro light-emitting element and device and transfer method thereof | Shao-Ying Ting, Junfeng Fan, Chen-ke HSU | 2024-07-16 |
| 11804578 | Micro light-emitting device and display | Chen-ke HSU, Chun-Yi Wu, Shaohua Huang | 2023-10-31 |
| 11804584 | Micro light-emitting element and device, and use and production method thereof | Zhibai Zhong, Jinjian Zheng, Zheng Wu, Chen-ke HSU, Junyong Kang | 2023-10-31 |
| 11742334 | Light-emitting assembly with raised adhesive layer | Tung-Kai Liu, Shao-Ying Ting, Chen-ke HSU | 2023-08-29 |
| 11616094 | Micro light-emitting component, micro light-emitting component matrix, and method for manufacturing the micro light-emitting component matrix | Shao-Ying Ting, Junfeng Fan, Chen-ke HSU | 2023-03-28 |
| 11557580 | Method and device for mass transfer of micro semiconductor elements | Zhibai Zhong, Jinjian Zheng, Jiansen ZHENG, Chen-ke HSU, Junyong Kang | 2023-01-17 |
| 11456400 | Light-emitting diode and method for transferring the same | Zheng Wu, Chen-ke HSU | 2022-09-27 |
| 11424387 | Micro light emitting diode chip and method for manufacturing micro light emitting diode device including the same | Chen-ke HSU, Zheng Wu | 2022-08-23 |
| 11424385 | Micro light-emitting element and device and transfer method thereof | Shao-Ying Ting, Junfeng Fan, Chen-ke HSU | 2022-08-23 |
| 11380829 | Light emitting device and light emitting device assembly | Shao-Ying Ting, Junfeng Fan, Chen-ke HSU | 2022-07-05 |
| 11127723 | Method for mass transfer of micro semiconductor elements | Zhibai Zhong, Jinjian Zheng, Jiansen ZHENG, Chen-ke HSU, Junyong Kang | 2021-09-21 |
| 11101239 | Process for packaging component | Zhibai Zhong, Jinjian Zheng, Lixun Yang, Chen-ke HSU, Junyong Kang | 2021-08-24 |
| 11043613 | Light emitting diode device and method for manufacturing the same | Zhibai Zhong, Jinjian Zheng, Lixun Yang, Chen-ke HSU, Junyong Kang | 2021-06-22 |
| 10297733 | High-voltage light emitting diode chip and fabrication method | Hou-Jun Wu, Jiansen ZHENG, Chen-ke HSU, Anhe HE | 2019-05-21 |
| 10283677 | LED structure and fabrication method | Xinghua Liang, Hongquan He, Te-Ling Hsia, Su-Hui Lin, Chen-ke HSU | 2019-05-07 |
| 10276750 | Bonding electrode structure of flip-chip led chip and fabrication method | Zhibai Zhong, Lixun Yang, Jinjian Zheng, Chen-ke HSU, Junyong Kang | 2019-04-30 |
| 10186637 | Flip-chip light emitting device and fabrication method | Zhibai Zhong, Wen-Yu Lin, YEN-CHIH CHIANG, Jianming Liu, Su-Hui Lin +1 more | 2019-01-22 |
| 10014460 | Flip-chip high-voltage light emitting device and fabrication method | Zhibai Zhong, YEN-CHIH CHIANG, Qiuyan FANG, Chen-ke HSU | 2018-07-03 |
| 9818915 | LED display and manufacturing method thereof | Chia-Hung Hou | 2017-11-14 |