Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237312 | Light-emitting diode packaging module | Shuning Xin, Chen-ke HSU, Aihua Cao, Junpeng SHI, Weng-Tack WONG +5 more | 2025-02-25 |
| 12230611 | Light-emitting device and display screen including the same | Yanqiu LIAO, Junpeng SHI, Shuning Xin, Chen-ke HSU, Changchin YU +4 more | 2025-02-18 |
| 12230612 | Light-emitting diode packaging module having encapsulated array of LED chips | Shuning Xin, Yanqiu LIAO, Junpeng SHI, Aihua Cao, Changchin YU +4 more | 2025-02-18 |
| 12080688 | Light-emitting diode packaging module | Yanqiu LIAO, Shuning Xin, Weng-Tack WONG, Junpeng SHI, Aihua Cao +5 more | 2024-09-03 |
| 11538965 | Light-emitting diode filament structure and LED lighting lamp including the same | Junpeng SHI, Chen-ke HSU, Ping Zhang | 2022-12-27 |
| 11462517 | Light-emitting diode device and white light emitting system | Ping Zhang, Junpeng SHI, Senpeng HUANG, Shunyi CHEN, Chen-ke HSU | 2022-10-04 |
| 11005008 | Method for manufacturing light emitting device | Senpeng HUANG, Weng-Tack WONG, Junpeng SHI, Shunyi CHEN, Chih-Wei Chao +1 more | 2021-05-11 |
| 10510938 | Package support, fabrication method and LED package | Jun-Peng Shi, Pei-Song Cai, Hao Huang, Xing Liang, Chih-Wei Chao +1 more | 2019-12-17 |
| 9711704 | Package support, fabrication method and LED package | Jun-Peng Shi, Pei-Song Cai, Hao Huang, Xing Liang, Chih-Wei Chao +1 more | 2017-07-18 |
| 9437793 | Package support, fabrication method and LED package | Jun-Peng Shi, Pei-Song Cai, Hao Huang, Xing Liang, Chih-Wei Chao +1 more | 2016-09-06 |