Light-emitting diode packaging module having encapsulated array of LED chips

Assignee

• Quanzhou Sanan Semiconductor Technology Co.

Inventors

• Shuning Xin (4 patents)
• Zhen-Duan Lin (10 patents)
• Yanqiu LIAO (9 patents)
• Junpeng SHI (35 patents)
• Aihua Cao (4 patents)
• Changchin YU (7 patents)
• Chen-ke HSU (77 patents)
• Chi-Wei Liao (20 patents)
• Chia-En Lee (47 patents)
• Zheng Wu (40 patents)

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