Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8298958 | Organic line width roughness with H2 plasma treatment | David C. Yang | 2012-10-30 |
| 7682985 | Dual doped polysilicon and silicon germanium etch | C. Robert Koemtzopoulos, Yoshinori Miyamoto, Yousun Taylor | 2010-03-23 |
| 7491343 | Line end shortening reduction during etch | Gowri Kota, Frank Y. Lin, Qinghua Zhong | 2009-02-17 |
| 7316785 | Methods and apparatus for the optimization of etch resistance in a plasma processing system | George Stojakovic, Alan J. Miller | 2008-01-08 |