Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12198945 | Vapor delivery head for preventing stiction of high aspect ratio structures and/or repairing high aspect ratio structures | Bhaskar BANDARAPU, David Mui, Karl-Heinz Hohenwarter, Butch Berney, Nathan Lavdovsky +4 more | 2025-01-14 |
| 9887122 | Method and apparatus for processing wafer-shaped articles | Hongbo Si, Bhaskar BANDARAPU, Andreas Gleissner | 2018-02-06 |