Issued Patents All Time
Showing 26–38 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5825084 | Single-core two-side substrate with u-strip and co-planar signal traces, and power and ground planes through split-wrap-around (SWA) or split-via-connections (SVC) for packaging IC devices | John Hon-Shing Lau, Yung-Shih Chen, Tai-Yu Chou, Frank H. Wu, Kuan L. Chen | 1998-10-20 |
| 5717247 | Microcircuit via interconnect | Connie S. McCausland | 1998-02-10 |
| 5599744 | Method of forming a microcircuit via interconnect | Connie S. McCausland | 1997-02-04 |
| 5493096 | Thin substrate micro-via interconnect | — | 1996-02-20 |
| 5475224 | Infrared detector substrate with breakaway test tabs | — | 1995-12-12 |
| 5464979 | Surround view detector focal plane | — | 1995-11-07 |
| 5393696 | Method for forming multilayer indium bump contacts | Wayne D. Kuipers | 1995-02-28 |
| 5209798 | Method of forming a precisely spaced stack of substrate layers | Allen L. Solomon, Alan E. Ingall | 1993-05-11 |
| 5149671 | Method for forming multilayer indium bump contact | Wayne D. Kuipers | 1992-09-22 |
| 5138164 | Infrared detector subarray with integral optical filter | — | 1992-08-11 |
| 5135556 | Method for making fused high density multi-layer integrated circuit module | William B. Hornback | 1992-08-04 |
| 5128749 | Fused high density multi-layer integrated circuit module | William B. Hornback | 1992-07-07 |
| 5075201 | Method for aligning high density infrared detector arrays | — | 1991-12-24 |