Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8692370 | Semiconductor device with copper wire ball-bonded to electrode pad including buffer layer | Takashi Kitazawa, Yasushige Sakamoto | 2014-04-08 |
| 7919875 | Semiconductor device with recess portion over pad electrode | Takashi Noma, Katsuhiko Kitagawa, Hisao Otsuka, Akira Suzuki, Yoshinori Seki +3 more | 2011-04-05 |
| 7456083 | Semiconductor device and manufacturing method of the same | Takashi Noma, Yoshinori Seki | 2008-11-25 |
| 7312107 | Semiconductor device and manufacturing method thereof | Takashi Noma, Katsuhiko Kitagawa, Hisao Otsuka, Akira Suzuki, Yoshinori Seki +3 more | 2007-12-25 |
| 7064046 | Manufacturing method of semiconductor device | Isao Ochiai, Ron Eyal, Gil Shetrit | 2006-06-20 |