Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8692370 | Semiconductor device with copper wire ball-bonded to electrode pad including buffer layer | Takashi Kitazawa, Motoaki Wakui | 2014-04-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8692370 | Semiconductor device with copper wire ball-bonded to electrode pad including buffer layer | Takashi Kitazawa, Motoaki Wakui | 2014-04-08 |