Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12210057 | Wafer-level test method for optoelectronic chips | Christian KARRAS, Tobias Gnausch, Robert BUETTNER, Kay Reetz, Armin Grundmann | 2025-01-28 |
| 12203983 | Contacting module for contacting optoelectronic chips | Robert BUETTNER, Armin Grundmann, Tobias Gnausch, Stefan Franz, Christian KARRAS | 2025-01-21 |
| 11906579 | Wafer-level test method for optoelectronic chips | Tobias Gnausch, Armin Grundmann, Norik Janunts, Robert BUETTNER, Christian KARRAS | 2024-02-20 |
| 11480495 | Position-tolerance-insensitive contacting module for contacting optoelectronic chips | Tobias Gnausch, Robert BUETTNER, Thomas Juhasz, Armin Grundmann, Thilo von Freyhold | 2022-10-25 |
| 8933546 | Electronic assembly with improved thermal management | Paeivi Lehtonen, Denis Gugel, Thomas Suenner, Tim Behrens | 2015-01-13 |
| 7581667 | Tool head for attaching an electrical conductor on the contact surface of a substrate and method for implementing the attachment | Manfred Reinold, Dirk Brinkmann | 2009-09-01 |
| 7582832 | Bond and method for bonding two contact surfaces | Manfred Reinold, Immanuel Mueller | 2009-09-01 |