SN

Shinichi Nitta

KT Kabushiki Kaisha Toshiba: 14 patents #2,131 of 21,451Top 10%
CK Ckd: 6 patents #29 of 332Top 9%
Ricoh Company: 5 patents #3,664 of 9,818Top 40%
CD Cdk: 1 patents #3 of 19Top 20%
SH Shimadzu: 1 patents #1,152 of 2,007Top 60%
SI Shinwa Chemical Industries: 1 patents #12 of 23Top 55%
TO Tokuyama: 1 patents #280 of 562Top 50%
📍 Miyoshi, JP: #87 of 2,464 inventorsTop 4%
Overall (All Time): #140,664 of 4,157,543Top 4%
27
Patents All Time

Issued Patents All Time

Showing 1–25 of 27 patents

Patent #TitleCo-InventorsDate
12280346 Micromixer Hiroshi Itafuji, Mitsuyoshi Ohsaki, Masahide Gunji, Hiroshi Kobayashi, Katsuya Okumura 2025-04-22
12196500 Heat exchange system Akihiro Ito, Takahiro Minatani 2025-01-14
12092242 Pipe welding structure Junya Hashizume, Mitsuyoshi Ohsaki 2024-09-17
9791808 Intermediate transfer belt, method for producing the same, and image forming apparatus Jun Aoto, Hidetaka Kubo, Kenichi Mashiko, Sayaka Katoh, Shigeo Oonuma 2017-10-17
9223256 Intermediate transfer belt method for producing intermediate transfer belt, and image forming apparatus Sayaka Katoh, Jun Aoto, Kenichi Mashiko, Atsuo Hirai 2015-12-29
9063475 Intermediate transfer belt and electrophotographic apparatus Jun Aoto, Hidetaka Kubo, Kenichi Mashiko, Sayaka Katoh 2015-06-23
8888471 Liquid feed pump and flow control device 2014-11-18
8807014 Multi-layer diaphragm Hiroshi Itafuji 2014-08-19
8760717 Intermediate transfer belt and image forming apparatus Hidetaka Kubo, Jun Aoto, Kenichi Mashiko, Sayaka Katoh 2014-06-24
8521073 Intermediate transfer member and image forming apparatus using the same Hidetaka Kubo, Jun Aoto, Kenichi Mashiko, Sayaka Katoh 2013-08-27
7700381 Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from them Tsunetoshi Arikado, Masao Iwase, Soichi Nadahara, Yuso Udo, Yukihiro Ushiku +8 more 2010-04-20
7510945 Element formation substrate, method of manufacturing the same, and semiconductor device Hajime Nagano, Takashi Yamada, Tsutomu Sato, Katsujiro Tanzawa, Ichiro Mizushima 2009-03-31
7439112 Semiconductor device using partial SOI substrate and manufacturing method thereof Hajime Nagano, Hisato Oyamatsu 2008-10-21
7420249 Semiconductor device formed in semiconductor layer arranged on substrate with one of insulating film and cavity interposed between the substrate and the semiconductor layer Tsutomu Sato, Hajime Nagano, Ichiro Mizushima, Takashi Yamada, Yuso Udo 2008-09-02
7285825 Element formation substrate for forming semiconductor device Hajime Nagano, Takashi Yamada, Tsutomu Sato, Katsujiro Tanzawa, Ichiro Mizushima 2007-10-23
7148543 Semiconductor chip which combines bulk and SOI regions and separates same with plural isolation regions Takashi Yamada, Hajime Nagano, Ichiro Mizushima, Tsutomu Sato, Hisato Oyamatsu 2006-12-12
7112822 Semiconductor device using partial SOI substrate and manufacturing method thereof Hajime Nagano, Hisato Oyamatsu 2006-09-26
7060133 Single crystal pulling apparatus for a metal fluoride Teruhiko Nawata, Hidetaka Miyazaki, Hiroyuki Yanagi, Harumasa Ito, Isao Yamaga 2006-06-13
7057259 Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from them Tsunetoshi Arikado, Masao Iwase, Soichi Nadahara, Yuso Udo, Yukihiro Ushiku +8 more 2006-06-06
7018904 Semiconductor chip having multiple functional blocks integrated in a single chip and method for fabricating the same Takashi Yamada, Hajime Nagano, Ichiro Mizushima, Tsutomu Sato, Hisato Oyamatsu 2006-03-28
7019365 Semiconductor device formed in semiconductor layer arranged on substrate with one of insulating film and cavity interposed between the substrate and the semiconductor layer Tsutomu Sato, Hajime Nagano, Ichiro Mizushima, Takashi Yamada, Yuso Udo 2006-03-28
6906384 Semiconductor device having one of patterned SOI and SON structure Takashi Yamada, Tsutomu Sato, Hajime Nagano, Ichiro Mizushima, Hisato Oyamatsu +3 more 2005-06-14
6855976 Semiconductor device using partial SOI substrate and manufacturing method thereof Hajime Nagano, Hisato Oyamatsu 2005-02-15
6835981 Semiconductor chip which combines bulk and SOI regions and separates same with plural isolation regions Takashi Yamada, Hajime Nagano, Ichiro Mizushima, Tsutomu Sato, Hisato Oyamatsu 2004-12-28
6630714 Semiconductor device formed in semiconductor layer arranged on substrate with one of insulating film and cavity interposed between the substrate and the semiconductor layer Tsutomu Sato, Hajime Nagano, Ichiro Mizushima, Takashi Yamada, Yuso Udo 2003-10-07