| 7232752 |
Method of removing contaminants from a silicon wafer after chemical-mechanical polishing operation |
Shao-Chung Hu, Teng-Chun Tsai, Chia-Lin Hsu |
2007-06-19 |
| 6696361 |
Post-CMP removal of surface contaminants from silicon wafer |
Shao-Chung Hu, Teng-Chun Tsai, Chia-Lin Hsu |
2004-02-24 |
| 6616510 |
Chemical mechanical polishing method for copper |
Chia-Lin Hsu, Teng-Chun Tsai, Ming-Sheng Yang |
2003-09-09 |
| 6569771 |
Carrier head for chemical mechanical polishing |
Juen-Kuen Lin, Tzu-Shin Chen, Chien-Hsin Lai |
2003-05-27 |
| 6486079 |
Method for stabilizing low dielectric constant materials |
Cheng-Yuan Tsai, Teng-Chun Tsai, Ming-Sheng Yang |
2002-11-26 |
| 6455432 |
Method for removing carbon-rich particles adhered on a copper surface |
Teng-Chun Tsai, Chia-Lin Hsu, Ming-Sheng Yang |
2002-09-24 |
| 6380069 |
Method of removing micro-scratch on metal layer |
Hsueh-Chung Chen, Ming-Sheng Yang |
2002-04-30 |