Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12009312 | Semiconductor device package | Chanyuan Liu, Kuo-Hsien Liao | 2024-06-11 |
| 11315858 | Chip package assembly with enhanced solder resist crack resistance | Suresh Ramalingam, Tien-Yu Lee, Jaspreet S. Gandhi | 2022-04-26 |
| 9070793 | Semiconductor device packages having electromagnetic interference shielding and related methods | Kuo-Hsien Liao, Chi-Hong Chan, Jian-Cheng Chen, Chian-Her Ueng | 2015-06-30 |