Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406951 | Redistribution layer having a sideview zig-zag profile | Kuan-Hsiang Mao, Tsung Nan Lo, Wen-Hung Huang | 2025-09-02 |
| 12198998 | Dielectric sidewall protection and sealing for semiconductor devices in a in wafer level packaging process | Kuan-Hsiang Mao, Che Ming Fang, Wen-Hung Huang | 2025-01-14 |
| 12119316 | Patterned and planarized under-bump metallization | Namrata Kanth, Paul Southworth, Scott M. Hayes, Dwight L. Daniels, Jeroen Johannes Maria Zaal +1 more | 2024-10-15 |
| 12080601 | Packaged semiconductor devices and methods therefor | Kuan-Hsiang Mao, Wen-Hung Huang | 2024-09-03 |
| 11935753 | Backside and sidewall metallization of semiconductor devices | Kuan-Hsiang Mao, Wen-Hung Huang, Che Ming Fang | 2024-03-19 |
| 11640947 | Pre-resist island forming via method and apparatus | Kuan-Hsiang Mao, Wen-Hung Huang, Che Ming Fang | 2023-05-02 |
| 11625729 | Data processing method, apparatus, and system | — | 2023-04-11 |
| 10124057 | Method of quickly producing antibodies against avian influenza and maintain antibody titer of duck | Ruiai Chen, Aiguo Zhang, Jiahua Xu, Shuqiong Zhang, Wenke Huang +2 more | 2018-11-13 |