YK

Young-Shin Kwon

Samsung: 11 patents #12,136 of 75,807Top 20%
SO Sonix: 2 patents #4 of 14Top 30%
Overall (All Time): #366,206 of 4,157,543Top 9%
13
Patents All Time

Issued Patents All Time

Showing 1–13 of 13 patents

Patent #TitleCo-InventorsDate
12417935 Systems, methods and apparatus for dispensing fluid to an object Paul Ivan John Keeton, James C. McKeon 2025-09-16
11779940 Systems, methods and apparatus for dispensing fluid to an object Paul Ivan John Keeton, James C. McKeon 2023-10-10
9113545 Tape wiring substrate and chip-on-film package including the same Sang-Uk Han, Kwan-Jai Lee, Jae-Min Jung, Kyong-Soon Cho, Jeong-Kyu Ha 2015-08-18
8853694 Chip on film package including test pads and semiconductor devices including the same Sang-Uk Han, Jeong-Kyu Ha, Seung Hwan Kim, Kwan-Jai Lee 2014-10-07
8278154 Method of fabricating a semiconductor device package including a heat radiation plate Han Shin Youn 2012-10-02
8054370 Wiring substrate, solid-state imaging apparatus using the same, and manufacturing method thereof Min Kyo Cho, Jae-Cheon Doh 2011-11-08
7659936 Wiring substrate, solid-state imaging apparatus using the same, and manufacturing method thereof Min Kyo Cho, Jae-Cheon Doh 2010-02-09
7405760 Image pickup device with non-molded DSP chip and manufacturing method Min Kyo Cho, Sa-Yoon Kang, Young-Hoon Ro 2008-07-29
6617700 Repairable multi-chip package and high-density memory card having the package Joon Ki LEE, Young-Hee Song 2003-09-09
6552423 Higher-density memory card Young Jae Song, Kun-Dae Youm, Young Soo Kim 2003-04-22
6483038 Memory card Joon Ki LEE, Woong Ky Ha, Young-Hee Song 2002-11-19
D445797 Memory card Joon Ki LEE, Ki-Won Choi 2001-07-31
5594275 J-leaded semiconductor package having a plurality of stacked ball grid array packages Seung Ho Ahn 1997-01-14